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Doping mechanism in tetrahedral amorphous carbon

机译:四面体无定形碳中的掺杂机理

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摘要

Doping in hydrogenated amorphous silicon occurs by a process of an ionised donor atom partially compensated by a haraged dangling bond. The total energies of various dopant and dopant/bonding combinations are calculated for tetrahedral amorphous carbon. It is found that charged dangling bonds are less favoured because of the stronger Coulombic repulsion in ta-C. Instead dopants can be compensated by weak bond states in the lower gap associated with odd-membered #pi#-rings or odd-numbered #pi#-chains. The effect is that the doping efficiency is low but there are not charged midgap recombination centres, to reduce photoconductivity with doping, as occurs in a-Si:H.
机译:氢化非晶硅中的掺杂是通过电离供体原子的过程发生的,该过程部分由经过的悬垂键补偿。计算了四面体非晶碳的各种掺杂剂和掺杂剂/键合组合的总能量。研究发现,由于ta-C中的库仑排斥力较强,带电悬空键不太受欢迎。相反,掺杂剂可以通过与奇数成员 #pi# 环或奇数 #pi# 链相关的较低间隙中的弱键态来补偿。其效果是掺杂效率低,但没有带电的中间隙复合中心,从而降低掺杂的光电导率,就像在a-Si:H中发生的那样。

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