Polyimids (PI) have been extensively used throughout themicroelectronics industry as a polymer dielectric. However the pooradhesive properties of polyimide can result in poor reliability indevices. In this research, the authors find that this newly developedaromatic thermosetting copolyesters (ATSP) provide a unique solutionto this problem and at the same time show very good adhesion tometals such as aluminum, titanium, and steel, as well as to ceramicssuch as silicon and silicon oxide. The ATSP has been shown to bondwith itself through a unique interchain transesterification reaction(ITR) at the interfaces between these polymers. A matrix ofexperiments for ultra-thin bonding different substrates via ITR hasbeen conducted using a modified tensile test to evaluate the bondstrength. The results show ATSP can be used as a general-purposeadhesive for bonding different materials together and particularlyfor PI to solve its poor adhesion in microelectronic devices. Also,this study provides the first known reported data on the behavior Ofthin film adhesive with bondline down lo sub-micron dimensions.
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