Recent studies evaluating surface wave plasma (SWP) and inductively coupled plasma (ICP) devices demonstrate the ability of point-of-use plasma abatement devices to attain high destruction and removal efficiency (DRE) for thermally stable fluorocompound (FC) gases from plasma etch tools. Plasma abatement is a practical alternative to thermal abatement devices for reduction of FC emissions from dielectric etch applications, with higher performance and lower CoO.
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