机译:A versatile interface model for thermal conduction phenomena and its numerical implementation by XFEM
School of Mechanical Engineering, Southwest Jiaotong University, Chengdu 610031, China;
Laboratoire Modélisation et Simulation Multi Echelle, MSME UMR 8208 CNRS, Université Paris-Est, 5 Bd Descartes, 77454 Marne-la-Vallée Cedex 2, France;