Formation process of intermittent molten bridge between Au-plated contacts at super low breaking velocity

摘要

This paper presents the molten bridge behaviors of Au-plated material at super low breaking velocity conditions by introducing our new designed test rig. The typical waveforms in the contact voltage and contact force during breaking were investigated under the load 5-25V/0.2-0.5A and velocity of 25-50nm/s. From the repetitive experimental results, we found that the intermittent molten bridge phenomena are formed from the competition of multitude contact a-spots for current distribution. Also, the possible bridge diameter is calculated with different bridge length and input power by using FEM thermal simulation and ISHIDA's experiment results. Finally, the effect of breaking velocity and electric load on bridge length and duration is also analyzed.