System in Package Feasibility Process

摘要

This paper describes the procedure and the software process to verify the feasibility of a system in package. The process has been created to guarantee and ensure the main characteristics of such devices: a minimum time-to-market and great flexibility. A procedure is described for every step, starting from application definition to final electrical analysis. After a general introduction, all process design steps are technically analyzed; then each step of the final process check is described. Some comments and wishes are discussed in the conclusion.