Thermal analysis of thermosetting phenolic compounds for injection molding

摘要

AbstractThe differential scanning calorimetry technique has been applied to investigate the curing of injection molding phenolic compounds. The data obtained include degree of cure, rate of curing, and heats and temperatures of curing as function of various heating rates, rate constants, energy of activation, and glass transition temperature. The curing temperature and heating rate were found to affect both the curing reaction kinetics and the final structure of the crosslinked network. The glass transition temperature changes continously with the extent of curing, approaching the cure temperature.