Contamination considerations for perfluoroelastomer seals used in deposition processes (excerpt)

摘要

Reducing contamination from particles, metallic contaminants and outgassing caused by seal deterioration are major goals of semiconductor fabricators. Perfluoroelastomers (FFKMs) are used in deposition processes due to their extraordinary chemical resistance and thermal , stability. Despite these qualities, FFKM performance can vary depending upon their chemical composition. Specially formulated compounds, such as Kalrez~reg; 9100, are designed to reduce contamination while maintaining sealing functionality in aggressive plasma environments.