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Carbonization behavior of polyimide films with various chemical structures

机译:具有不同化学结构的聚酰亚胺薄膜的碳化行为

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AbstractSix kinds of polyimide films with different molecular structures were synthesized and carbonized up to 1100°C. The carbonization behavior of polyimides was followed by measuring the changes in weight, size, and electrical conductivity. Pyrolysis gases evolved on the way to carbonize up to 1000°C were analyzed by gas chromatography.All films showed appreciable shrinkage and became a black color above 500°C. No cracks and pores were observed on the films heated up to 1100°C, even under the scanning electron microscope. A large weight decrease of 35–50 was observed in a narrow temperature range from 500 to 650°C, which seemed to be due to the departure of CO groups as either CO or CO2. An additional weight decrease occurred gradually above 800°C, due to N2departure. A remarkable increase of electrical conductivity along the film surface, more than 2 orders, was observed with the increase in heat‐treatment temperature. The polyimide film with a flat molecular structure (PMDA/PPD) gave the highest conductivity: 3.7
机译:摘要 合成了6种不同分子结构的聚酰亚胺薄膜,并在1100°C下碳化。 聚酰亚胺的碳化行为随后测量了重量、尺寸和电导率的变化。通过气相色谱分析了在高达1000°C的碳化过程中释放出的热解气体。所有薄膜都显示出明显的收缩率,并在500°C以上变成黑色。 即使在扫描电子显微镜下,加热到1100°C的薄膜上也没有观察到裂纹和气孔。在 500 至 650°C 的狭窄温度范围内观察到 35-50% 的重量大幅下降,这似乎是由于 CO 基团以 CO 或 CO2 的形式离开。由于N2离开,在800°C以上,重量逐渐下降。随着热处理温度的升高,沿薄膜表面的电导率显着增加,超过2个数量级。具有扁平分子结构的聚酰亚胺薄膜(PMDA/PPD)的电导率最高:3.7

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