Minimizing the hot spots IC design

摘要

The MOVER software allows IC designers to create a quick and accurate thermal profile of the chips they design. This program is particularly useful when gallium arsenide is used for the fabrication of semiconductors, as its low thermal conductivity can lead to local hot spots on the circuit die. In addition to the thermal profile, the MOVER program also suggests changes to the circuit layout that can dramatically improve the thermal profile of a chip. The new software gives IC designers more flexibility in the use of an inexpensive design tool, and a better understanding of thermal reliability issues that arise in GaAs and dense Si chips