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Enhanced growth of intermetallic phases in the Ni-Ti system by current effects

机译:电流效应促进Ni-Ti体系中金属间相的生长

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The effect of direct current upon interfacial reactions in the Ni-Ti system was investigated. Isothermal diffusion couple experiments were conducted under varying current densities to dc-couple Joule heating from intrinsic effects of the current flux. Current densities of up to 2546 A cm~2 were used in the temperature range of 625-850 deg C. All of the intermetallic compounds (NiTi, Ni_3Ti and NiTi_2) present in the equilibrium phase diagram were identified in the product layer. In addition, beta-Ti solid solutions formed in samples annealed above the alpha->beta temperature, 765 deg C. The growth of all product layers was found to be parabolic and the applied current was found to significantly increase the growth rate of the intermetallic layers. Using Wagner's analysis the present results were compared to published results on current-free diffusion couples. The intrinsic growth rate constant of the NiTi_2 intermetallic was found to be 43 times higher under the influence of 2546 A cm~2 than that obtained without a current at 650 deg C. The effective activation energy for the formation of all phases was found to decrease with increasing current density. The effect was strong for all phases but the decrease was most marked for Ni3Ti. In this case, the activation energy decreased from 292 kJ mol~(-1) under the influence of a current density of 1527 A cm~(-2) to 86 kJ mol~(-1) when the current density was 2036 A cm~(-2). The results are explained in terms of current induced changes in the growth mechanism arising from changes in the concentration of point defects or their mobility.
机译:研究了直流电对Ni-Ti体系界面反应的影响。在电流通量的内在效应下,在不同的电流密度下进行直流耦合焦耳加热的等温扩散耦合实验。在625-850°C的温度范围内,电流密度高达2546 A cm~2。平衡相图中存在的所有金属间化合物(NiTi、Ni_3Ti和NiTi_2)均在产物层中鉴定。此外,在高于α->β温度(765°C)退火的样品中形成的β-Ti固溶体。发现所有产物层的生长都是抛物线的,并且发现施加的电流显着提高了金属间层的生长速率。使用Wagner的分析,将本结果与已发表的无电流扩散耦合结果进行了比较。在2546 A cm~2的影响下,金属间化合物NiTi_2的内在生长速率常数比在650 °C下无电流时高43倍。研究发现,所有相形成的有效活化能随着电流密度的增加而降低。所有相的效果都很强,但Ni3Ti的下降最为明显。本例中,当电流密度为2036 A cm~(-2)时,活化能从1527 A cm~(-2)的292 kJ mol~(-1)降低到86 kJ mol~(-1)。这些结果可以解释为由点缺陷的浓度或其迁移率的变化引起的电流引起的生长机制的变化。

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