We have developed a method for estimating the heat-transfer properties of a resin by using the sum of the bulk thermal resistance and the thermal contact resistance. This method was applied to a temperature cycling test of thermally conductive silicone rubber sheet of constant thickness. The test results show that the sum of thermal resistances increases with increasing number of temperature cycles. It is thus concluded that the heat-transfer properties of the resin change after several hundred temperature cycles and that this change should be taken into account in the thermal design of electronic devices.
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