A dual-phase-lag diffusion (DPLD) model is presented for predicting the intermetallic compound (IMC) layer growth in solder joints. It extends from Fick's law by taking into account the delayed response between the interdiffusion of two dissimilar materials and the chemical reaction that forms the IMC. The merit of this model is that it uniquely represents four different types of IMC growth kinetics, all of which are found in the literature. Comparison between the model and experimental results for 100Sn/Cu and Ag/Zn systems demonstrates that the proposed DPLD model captures the growth history of IMC layers quite well.
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