首页> 外文期刊>Proceedings of the Institution of Mechanical Engineers, Part C. Journal of mechanical engineering science >Theoretical modeling of the critical conditions for ductile-regime milling of single crystalline silicon
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Theoretical modeling of the critical conditions for ductile-regime milling of single crystalline silicon

机译:Theoretical modeling of the critical conditions for ductile-regime milling of single crystalline silicon

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摘要

This paper introduces a new method to build a general model for estimating the critical micromilling conditions for single crystalline silicon by considering micromilling process variables based on the generally-accepted indentation model. The analytical results show that cutting edge radius and the feed rate affect the critical conditions greatly. Furthermore, the step over percentage of the cutter radius affects the critical feed rates and the machining efficiency. It shows that an appropriate cutting edge radius is the key factor to achieve high machining efficiency while ductile-regime micromilling conditions are satisfied.

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