Millimeter-Wave Dipole Antenna on a Thick Resin Layer on the Back Side of a Silicon CMOS Chip

摘要

This paper proposes a dipole antenna integrated on a thick resin layer on the opposite side of a RF circuit layer though a hole in a silicon CMOS chip at 60GHz. The thick resin layer can enhance the radiation efficiency. The connection loss between the antenna and the RF circuit is expected to be small. The simulated gain of a dipole on a resin layer of 200μm thickness over a 5mm square silicon chip is 5.4dBi. The measured gain of 3.1dBi is achieved even though the reflection is -6dB. The roughness of the sidewalls of the hole and posts by laser opening, the spread of thin copper with 2mm thickness and the connection loss in the measurement could degrade the gain.