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Curing behavior, mechanical and thermal properties of epoxy‐CeO2 nanocomposites

机译:环氧-CeO2纳米复合材料的固化性能、力学和热性能

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摘要

Abstract Nanoparticles have been widely used in the improvement of the mechanical and thermal properties of the epoxy matrix. In this study, the room temperature curing agent composed of acrylic acid and 2,4,6‐trimethyl‐m‐phenylenediamine was mixed with different concentrations of CeO2 nanoparticles into the epoxy resin (E51) to obtain a nanocomposite that can be rapidly molded and cured. Fourier transform infrared spectroscopy and differential scanning calorimetry were used to study the curing behavior of nanocomposites and E51 with the synthesized hardener. Through tensile, flexural, and impact tests, the influence of the nanoparticles content on the mechanical and thermal properties of the prepared composites was discussed. The results showed that the curing process was completed in 4 h. An increase of 78.4 in tensile strength, 81.7 in flexural strength, and 122.0 in elongation were obtained for the cured nanocomposite having 5 wt CeO2 loading compared to the neat resin. Thermogravimetric analysis result showed that the thermal stability increased with increasing of CeO2 nanofillers content. Finally, the scanning electron microscope revealed the fracture surface morphology of the composites.
机译:摘要 纳米粒子在环氧基体力学性能和热性能的改善中得到了广泛的应用。本研究将丙烯酸和2,4,6-三甲基间苯二胺组成的室温固化剂与不同浓度的CeO2纳米颗粒混合到环氧树脂(E51)中,得到可快速成型固化的纳米复合材料。采用傅里叶变换红外光谱和差示扫描量热法研究了纳米复合材料和E51与合成固化剂的固化行为。通过拉伸、弯曲和冲击试验,探讨了纳米颗粒含量对制备复合材料力学性能和热性能的影响。结果表明,固化过程在4 h内完成。与纯树脂相比,CeO2负载量为5 wt%的固化纳米复合材料的拉伸强度提高了78.4%,弯曲强度提高了81.7%,伸长率提高了122.0%。热重分析结果表明,随着CeO2纳米填料含量的增加,其热稳定性增加。最后,扫描电镜揭示了复合材料的断裂表面形貌。

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