首页> 外文期刊>chemistryselect >Effect of Cu Vacancy on Cu3Si(001) Surface for the Synthesis of SiHCl3 by Hydrogenation of SiCl4:A DFT Study
【24h】

Effect of Cu Vacancy on Cu3Si(001) Surface for the Synthesis of SiHCl3 by Hydrogenation of SiCl4:A DFT Study

机译:Effect of Cu Vacancy on Cu3Si(001) Surface for the Synthesis of SiHCl3 by Hydrogenation of SiCl4:A DFT Study

获取原文
获取原文并翻译 | 示例
           

摘要

In this paper, the effect of Cu vacancy of Cu3Si(001) surface for the hydrogenation of silicon tetrachloride was systematically studied by density functional theory (DFT). The favorable adsorption sites and stable configurations of reaction species are obtained and three possible reaction paths of SiHCl3 formation were achieved by transition state search. For the perfect Cu3Si(001) surface(P), Path1 is the most favorable, with a reaction barrier of 158.15 kJ mol(-1). For both the single Cu-vacancy(SV) and double Cu-vacancy Cu3Si(001) surface(DV), Path2 is the most favorable, with the reaction barriers of 130.07 kJ mol(-1) and 124.81 kJ mol(-1), respectively. The results reflect that the activation energy of the reaction decreased significantly with the increase of Cu-vacancy on the Cu3Si(001) surface, which may be the reason for the higher catalytic activity of Cu3Si catalysts with smaller Cu-Si stoichiometric ratios. This study can provide a reasonable explanation for previously experimental observation and provide a guidance for future catalyst design.

著录项

获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号