首页> 外文期刊>Materials Letters >Preparation of Si thin films on copper foil using pulse current electrodeposition
【24h】

Preparation of Si thin films on copper foil using pulse current electrodeposition

机译:Preparation of Si thin films on copper foil using pulse current electrodeposition

获取原文
获取原文并翻译 | 示例
           

摘要

Si has extremely high specific capacity, which has been widely used in the field of new energy materials. In this paper, Si thin films was prepared on copper foil by pulse current electrodeposition, and the electrodeposition process was systematically analyzed. For a comparison, Si thin films prepared by Direct Current (DC) electrodeposition was also discussed. The research results show that the uniform and dense films can be prepared by pulse current electrodeposition using organic solvent, and the films is mainly composed of Si and SiOx. The electrodeposition can be divided into two stages: instantaneous nucleation and growth of Si, and the relatively dense Si thin films will be obtained on the working electrode (copper foil) surface.

著录项

获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号