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Enhanced Carrier Transport in X-Ray Detector Based on Cs_3Bi_2I_9/MXene Composite Wafers

机译:基于Cs_3Bi_2I_9/MXene复合晶圆的X射线探测器增强载流子传输

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摘要

Intrinsically high attenuation of X-rays and excellent optoelectronic properties endow Cs_3Bi_2I_9 with great promise for high-performance X-ray detectors. However, preparation of high quality Cs_3Bi_2I_9 single crystal with large area and millimeter-thick remains challenging and time-consuming. A size scalable growth technology, a mechanical sintering process, which is applicable for the integration in image detectors is proposed in this work. Compared with the Cs_3Bi_2I_9 wafer, the Cs_3Bi_2I_9/MXene composite wafer exhibits higher carrier transfer efficiency and mobility-lifetime product through incorporation of Ti3C2Tx MXene multilayer nanoflakes (MXene nanoflakes). The Cs_3Bi_2I_9/MXene composite wafer X-ray detector shows an excellent linearity of X-ray response, a fast response speed, and a low limit of detection of 231 nGyair s~(?1). The sensitivity of 368 μC Gyair~(?1) cm~(?2) under 120 V mm~(?1) is achieved, which is 15.4 enhanced over the Cs_3Bi_2I_9 wafer detector. The sensitivity of Cs_3Bi_2I_9/MXene wafer device enhances ≈20–40 at low applied voltage regime. In addition, the Cs_3Bi_2I_9/ MXene wafer detector exhibits excellent operational stability after storage for 12 months in ambient air. This work provides an alternative approach for realization of next-generation high-performance perovskite X-ray detectors.
机译:X射线固有的高衰减和优异的光电特性使Cs_3Bi_2I_9具有高性能X射线探测器的巨大前景。然而,制备大面积、毫米厚的高质量Cs_3Bi_2I_9单晶仍然具有挑战性和耗时。本文提出了一种尺寸可扩展的生长技术,一种适用于图像探测器集成的机械烧结工艺。与Cs_3Bi_2I_9片相比,Cs_3Bi_2I_9/MXene复合晶片通过掺入Ti3C2Tx MXene多层纳米片(MXene纳米片)表现出更高的载流子转移效率和迁移寿命积。Cs_3Bi_2I_9/MXene复合晶圆X射线探测器具有优异的X射线响应线性度、快速响应速度和231 nGyair s~(?1)的检测下限。在120 V mm~(?1)下,灵敏度达到368 μC Gyair~(?1) cm~(?2),比Cs_3Bi_2I_9晶圆探测器提高了15.4%。Cs_3Bi_2I_9/MXene晶圆器件的灵敏度在低电压范围内提高了≈20-40%。此外,Cs_3Bi_2I_9/MXene晶圆探测器在环境空气中储存12个月后,表现出出色的操作稳定性。本工作为实现下一代高性能钙钛矿X射线探测器提供了一种替代方法。

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