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首页> 外文期刊>IEEE journal of selected topics in quantum electronics: A publication of the IEEE Lasers and Electro-optics Society >Advanced Transfer Printing With In-Situ Optical Monitoring for the Integration of Micron-Scale Devices
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Advanced Transfer Printing With In-Situ Optical Monitoring for the Integration of Micron-Scale Devices

机译:先进的转印与原位光学监测,用于微米级设备的集成

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Transfer printing integration of planar membrane devices on photonic and electronic circuits is becoming a well established technology. Typical systems incorporate a single planar layer printed into full contact with the host substrate. In this work we present an advanced transfer print system that enables printing of optical devices in non-planar geometries and allows in-situ optical monitoring of devices. We show micro-resonators with air-clad whispering gallery modes coupled to on-chip waveguides, inverted device printing and three dimensionally assembled micro-cavities incorporating semiconductor micro-lenses and nanowire lasers. We demonstrate printing onto non-standard substrates including optical chip facets and single-mode fibre ends. The optical fibre printing was carried out with alignment assistance from in-situ optical coupling through the transfer printing system in real-time allowing active alignment of the system.
机译:在光子和电子电路上集成平面膜器件的转移印刷正在成为一项成熟的技术。典型的系统包含与主体基板完全接触的单个平面层印刷。在这项工作中,我们提出了一种先进的转印系统,该系统能够以非平面几何形状打印光学设备,并允许对设备进行原位光学监控。我们展示了与片上波导耦合的空气包层耳语画廊模式的微谐振器、倒置器件打印和包含半导体微透镜和纳米线激光器的三维组装微腔。我们演示了在非标准基板上印刷,包括光学芯片刻面和单模光纤端。光纤打印是在原位光学耦合的辅助下通过转印系统实时进行的,从而实现系统的主动对准。

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