Evaluation and Extraction of Equivalent Circuit Parameters for GSG-type Bonding Wires Using Electromagnetic Simulator

摘要

In this paper, the author performed an electromagnetic fieldsimulation of a typical bonding wire structure that connects a chip and apackage, and evaluated the signal transmission characteristics (Sparameters).In addition, the inductance per unit length was extracted bycomparing with the equivalent circuit of the distributed constant line. Itturns out that the distributed constant line model is not sufficient becausethere are frequencies where chip-package resonance occurs. Below theresonance frequency, the conventional low-frequency approximation modelwas effective, and it was found that the inductance was about 1 nH/mm.