According in a first aspect of the current disclosure, there is provided a method of metrology comprising: obtaining measured data relating to at least one measurement by a measurement apparatus configured to irradiate radiation onto each of one or more structures on a substrate; decomposing the measured data using a decomposition method to obtain multiple measured date components; obtaining simulated data relating to at leas) one simulation based on the one or more structures; decomposing the simulated data using the decomposition method to obtain multiple simulated data components; matching between at least a portion of the simulated data components and at least a portion of the measured data components; and extracting a feature of the substrate based on the matching of at least a portion of the simulated data components and at least a portion of the measured data components. In another aspect of the invention there is provided a method of metrology comprising: illuminating a radiation onto a substrate; obtaining a measured data relating to at least one measurement of each of one or more structures on the substrate; decomposing the measured data using a decomposition method to obtain multiple measured data components; obtaining a simulated data relating to at least one simulation based on the one or mare structures: decomposing the simulated data using the decomposition method to obtain multiple simulated data components; matching between at least a portion of the simulated data components and at least a portion of the measured data components; and extracting a feature of the substrate, Optionally, the one or more structures comprise vertically stacked nanosheets and/or alternating layers with different materials.
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