Advanced electronic devices are supposed to highly integrated, such as wearable electronics, bioelectronics, and light-emitting diodes. The circuits are required to be fabricated compactly to the structure. This study proposed an approach to achieve close fabrication of circuit and structure. We used digital light processing additive manufacturing to rapidly form substrate structure, which is composed of ultraviolet-curable resin and Cu-2(OH)PO4 particle. The substrate structure was then processed by laser activation and electroless plating metallization. As a result, the selective circuit can be fabricated on the surface of substrate structure. A series of characterizations were conducted using SEM, XPS, CLSM, and so on to investigate the morphology and analyze the surface chemistry of composite. After 5 min electroless copper plating, the resistivity of copper circuit on composite were 7.5 x 10(-8) omega center dot m. The obtained copper layer has good adhesion property (highest 5B level after adhesion test). This work provides an approach for complex structures of circuit and structure integrated devices, which has a potential application in advanced electronic devices.
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