机译:On coupling contact analysis of thermoelectric materials
Tongji Univ, Sch Aerosp Engn & Appl Mech, Shanghai 200092, Peoples R China;
Ningxia Univ, Sch Math & Stat, Yinchuan 750021, Ningxia, Peoples R China;
Seebeck effect; Punch; Closed-form solution; Surface contact stress; Intensity factors;