A lithographic apparatus may be used to apply a desired pattern onto a substrate. A lithographic apparatus can be used, for the manufacture of integrated circuits (ICs), for example. A lithographic apparatus may include a source of extreme ultra-violet radiation (EUV) which is directed to a patterning device (e.g. a reticle), which patterns the beam, which is then projected onto a substrate. The lithographic apparatus may include so-called "clean" regions and so-called dirty regions. The "clean" regions of the lithographic apparatus contain crucial optical components (e.g. the reticle) and may be kept substantially in vacuum, i.e. at a very low pressure, with a purging fluid (e.g. hydrogen gas) used to keep critical components (e.g. optical components) clean The EUV radiation may interact with the purging fluid and form a plasma in the clean regions. So-called "dirty" regions of the lithographic apparatus comprise pails and devices that generate debris, e.g. moveahle components that generate debris. The debris may be deposited on the components of the lithographic apparatus during installation by the user, which is detrimental to the optical components if said matter enters the "clean" region.
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