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Achieving smooth PZT surface via chemical mechanical polishing with ethylenediamine dihydrochloride

机译:用乙二胺二盐酸盐进行化学机械抛光,实现光滑的PZT表面

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? 2022 Elsevier Ltd and Techna Group S.r.l.Lead zirconate titanate (PZT) has been widely used in microelectromechanical systems and ferroelectric memory, and a high-quality PZT surface is important to the device performance. In this study, chemical mechanical polishing (CMP) was introduced to process PZT-4 (Pb(Zr0.44Ti0.56)O3). A complexing agent ethylenediamine dihydrochloride (EDA·2HCl) was used as a crucial chemical additive in slurries to improve the CMP performance of PZT-4 because it may chelate metal ions of PZT-4, such as Ti4+. The results show that the material removal rate (MRR) of PZT-4 decreases and the surface roughness Sa increases as pH increases. At pH 4.0, with the EDA·2HCl concentration increasing, the MRR first increases, reaches the summit of 498 nm/min at 0.75 mM, and then decreases and levels off. The Sa has a similar trend. With 50 mM EDA·2HCl, the Sa reaches the minimum value of 3.5 nm, and no processing damage occurs in the substrate. For the removal mechanism, EDA can be adsorbed on PZT-4 probably via forming complex with Ti4+. With a low content of EDA·2HCl, the adsorbates of EDA distribute discretely and can be removed easily, and thus the MRR is high. As the content of EDA·2HCl increases, a relatively continuous and uniform film is formed to suppress dissolution and abrasion, and thus the MRR decreases. A two-step CMP process was developed, and a smooth PZT surface can be rapidly achieved. This study provides mechanistic insight of the role of EDA in the CMP of PZT-4, and may open new avenues of developing CMP slurries for achieving smooth surfaces of PZT materials via screening prospective complexing agents.
机译:?2022 Elsevier Ltd 和 Techna Group S.r.l.锆钛酸铅 (PZT) 已广泛应用于微机电系统和铁电存储器,高质量的 PZT 表面对器件性能至关重要。本研究采用化学机械抛光(CMP)技术制备PZT-4(Pb(Zr0.44Ti0.56)O3)。络合剂乙二胺二盐酸盐(EDA·2HCl)作为浆料中的重要化学添加剂,可以螯合PZT-4的金属离子,如Ti4+,从而改善PZT-4的CMP性能。结果表明:随着pH值的增加,PZT-4的材料去除率(MRR)降低,表面粗糙度Sa增加;在pH 4.0时,随着EDA·2HCl浓度的增加,MRR先增加,在0.75 mM时达到498 nm/min的峰值,然后降低并趋于平稳。Sa也有类似的趋势。使用50 mM EDA·2HCl时,Sa达到最小值3.5 nm,并且不会在衬底中发生加工损伤。对于去除机理,EDA可能通过与Ti4+形成络合物可以吸附在PZT-4上。EDA·2HCl含量低,EDA吸附物分布离散,易于去除,MRR较高。随着EDA·2HCl含量的增加,形成相对连续均匀的薄膜,抑制溶解和磨损,从而降低MRR。开发了两步CMP工艺,可以快速实现光滑的PZT表面。本研究为EDA在PZT-4的CMP中的作用提供了机理见解,并可能为开发CMP浆料开辟新的途径,通过筛选前瞻性络合剂来实现PZT材料的光滑表面。

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