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机译:Interfacial thermal stress relief in Ag–SnO2 composites by in situ formation of CuO nanoparticles additive on SnO2
Department of Engineering Mechanics Shijiazhuang Tiedao University;
School of Civil Engineering Shijiazhuang Tiedao University;
Ag-SnO2 composite; Crack resistance; CuO additive; Thermal stress relief;