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机译:A new method for high resolution curvature measurement applied to stress monitoring in thin films
UMR 125 CNRS St Gobain Rech;
Sorbonne Univ;
wafer curvature; stress-thickness; growth; digital image correlation; thin film; INTRINSIC STRESS; RESIDUAL-STRESS; EPITAXIAL AG; AU FILMS; POLYCRYSTALLINE; FIELD; EVOLUTION; SURFACE; STRAIN; CU;