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Ni/h-BN composites with high strength and ductility

机译:具有高强度和延展性的Ni/h-BN复合材料

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摘要

Ni-xBN composites (x = 0.001, 0.05, and 0.1 wt) with enhanced tensile and bending strength, as well as high ductility were fabricated by a combination of ball milling and spark plasma sintering. Material with 0.05 wt of hexagonal BN (h-BN) nanoflakes show an increase in tensile strength of 26 (25 degrees C) and 63 (750 degrees C) compared to additive-free Ni counterpart and high ductility. Doping with h-BN increases the resistance to plastic deformation at both room and high temperatures. The bending strength of Ni-0.05BN composite at room temperature has been increased by 121. Small addition of h-BN leads to a decrease in the Ni grain size, and solid solution and grain boundary strengthening.
机译:采用球磨和火花等离子烧结相结合的方法制备了具有增强拉伸强度和弯曲强度以及高延展性的Ni-x%BN复合材料(x = 0.001、0.05和0.1 wt%)。与无添加剂的镍合金相比,具有0.05wt%六方氮化硼(h-BN)纳米薄片的材料显示出26%(25°C)和63%(750°C)的拉伸强度和高延展性。掺杂h-BN可提高室温和高温下的塑性变形能力。Ni-0.05%BN复合材料在室温下的抗弯强度提高了121%。少量添加h-BN会导致Ni晶粒尺寸减小,固溶体和晶界强化。

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