机译:Bonding mechanism in ultrasonic-assisted soldering of ZrO2 and 304 stainless steel using a micro-alloyed active solder alloy
Hohai Univ;
Changzhou Vocat Inst Mechatron Technol;
Hohai Univ||Shantou Univ;
Ultrasonic active soldering; Microalloying; Ceramics; Microstructure;