机译:Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds
SUNY Binghamton;
Showa Denko Mat Co Ltd;
NXP SemicondTexas Instruments Inc;
microjoints; heat sinks; copper nanoparticles; rapid sintering; porosity; particle size; macroscopic strain; inelastic deformation; impression creep test; diffusion creep; dislocations; annealing; coarsening; surface diffusion; oxidation; GRAIN-GROWTH; CREEP;