The aim of this study is to highlight the key elements for optimizing printed circuit board (PCB) fabrication productivity through improving manufacturing process efficiency. Failure mode and effect analysis (FMEA) is a technique used to reduce the percentage of finished goods that are found to be defective during the manufacturing process and final inspection, resulting in low rejection ratios and optimized PCB design. This paper presents all the quality steps to achieve high efficiency in PCB design. The study is done in electronics manufacturing industry in which its production begins from receiving PCBs, raw material then bringing them into punching and assembly processes through surface mount machines (SMT). To find defective items and lower the possibility of defective final products, or IPQC (in-process quality control), is used. The average of customer manufacturers lot reject rate (%LRR of CMs) has been improved by using improved quality control. For assessing the risk connected to probable issues discovered during a failure mode and effects analysis, the risk priority number (RPN) methodology technique is applied. The FMEA RPN assists the responsible team or individual in prioritizing risks and choosing the appropriate remedial measures. Lot reject rate (LRR) improved by FMEA is from 5500 parts per million (PPM) to 900 parts per million (PPM), and faults have decreased by 0.76% as a result of improved quality control.
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