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首页> 外文期刊>Polymer Composites >A thermal conductivity computation model of the carbon fiber reinforced polymer/aramid fiber reinforced polymer laminate considering the bi‐material composite interfaces
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A thermal conductivity computation model of the carbon fiber reinforced polymer/aramid fiber reinforced polymer laminate considering the bi‐material composite interfaces

机译:A thermal conductivity computation model of the carbon fiber reinforced polymer/aramid fiber reinforced polymer laminate considering the bi‐material composite interfaces

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摘要

Abstract A thermal conductivity computation model for carbon fiber reinforced polymer/aramid fiber reinforced polymer bi‐material composites was proposed, where thermal resistances of the fibers and matrix were regarded as the electrical resistances in circuit, and was validated by thermal response test with relative error less than 7.5%. After effect of thickness of the aramid fiber layer and that of heating temperature were discussed, it was applied to analyze the thermal response under the deep‐sea oil‐lifting condition. It was found that: (1) specimen with more than two layers (>0.56 mm) of aramid fibers shows better thermal insulation; (2) the higher the heating temperature is, the better the thermal insulation effect is, especially for specimens with multi‐layer aramid fibers.

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