机译:Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures
SUNY Binghamton;
NXP Semicond;
Universal Instruments CorpKoki Solder Amer Inc;
SN-AG-CU; MECHANICAL-PROPERTIES; SOLDER JOINTS; MICROSTRUCTURE; BEHAVIOR; ALLOYS;