机译:勘误表 “3-D 打印矩形波导 123–129 GHz 商用 CMOS RFIC 封装”勘误表
Department of Electrical and Electronic Engineering, Imperial College London, London, U.K.;
Department of Electromagnetic and Electrochemical Technologies, National Physical Laboratory, Teddington, U.K.;
Research Institute of Electrical Communication, Tohoku University, Sendai, Japan;
Wireless communication; Microwave technology; Rectangular waveguides; Production; Packaging; CMOS technology; Radiofrequency integrated circuits;