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Nanoscale layer of a minimized defect area of graphene and hexagonal boron nitride on copper for excellent anti-corrosion activity

机译:石墨烯和六方氮化硼在铜上的最小缺陷区域的纳米级层,具有出色的防腐活性

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摘要

In this work, we synthesized a monolayer of graphene and hexagonal boron nitride (hBN) using chemical vapor deposition. The physicochemical and electrochemical properties of the materials were evaluated to determine their morphology. High-purity materials and their atomic-scale coating on copper (Cu) foil were employed to prevent fast degradation rate. The hexagonal two-dimensional (2D) atomic structures of the as-prepared materials were assessed to derive their best anti-corrosion behavior. The material prepared under optimized conditions included edge-defect-free graphene nanosheets (similar to 0.0034 mu m(2)) and hBN (similar to 0.0038 mu m(2)) per unit area of 1 mu m(2). The coating of each material on the Cu surface significantly reduced the corrosion rate, which was similar to 2.44 x 10(-2)/year and 6.57 x 10(-3)/year for graphene/Cu and hBN/Cu, respectively. Importantly, the corrosion rate of Cu was approximately 3-fold lower after coating with hBN relative to that of graphene/Cu. This approach suggests that the surface coating of Cu using cost-effective, eco-friendly, and the most abundant materials in nature is of interest for developing marine anti-corrosion micro-electronic devices and achieving surface modification of pure metals in industrial applications.
机译:在这项工作中,我们使用化学气相沉积合成了单层石墨烯和六方氮化硼(hBN)。对材料的理化和电化学性质进行了评估,以确定其形貌。采用高纯度材料及其在铜箔上的原子级涂层,以防止快速降解。对所制备材料的六方二维原子结构进行了评估,得出了其最佳的防腐性能。在优化条件下制备的材料包括单位面积为1 μ m(2)的无边缘缺陷石墨烯纳米片(类似于0.0034 μ m(2))和hBN(类似于0.0038 μ m(2))。每种材料在Cu表面的涂层显著降低了腐蚀速率,石墨烯/Cu和hBN/Cu的腐蚀速率分别为2.44×10(-2)/年和6.57×10(-3)/年。重要的是,与石墨烯/Cu相比,hBN涂层后Cu的腐蚀速率降低了约3倍。该方法表明,使用经济高效、环保且自然界中含量最丰富的材料对Cu进行表面涂层对于开发海洋防腐微电子器件和实现工业应用中纯金属的表面改性具有重要意义。

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