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机译:All-wet encapsulation and electroless superfilling process for the fabrication of self-assembled-monolayer encapsulated copper interconnects with enhanced electromigration reliability
Feng Chia Univ, Dept Mat Sci & Engn, Taichung 407, Taiwan;
Feng Chia Univ, Dept Mat Sci & Engn, Taichung 407, Taiwan|TSMC, Fab 18, Tainan Sci Pk, Tainan, Taiwan;
Feng Chia Univ, Dept Mat Sci & Engn, Taichung 407, Taiwan|Micron Technol Inc, Taichung, TaiwanNatl Chi Nan Univ, Dept Elect Engn, Nantou 545, TaiwanNatl Formosa Univ, Dept Mat Sci & Engn, Huwei Township 632, Yunlin, Taiwan;
Functional; Deposition; Electron microscopy; Electrical properties; Thin films;