Improvement for electrical conductivity of Ti3SiC2/Cu joint brazed with a novel Sn6Ag7Ni4Co2Ti low-melting high entropy alloy filler

摘要

Reducing the interfacial electrical resistance of Ti3SiC2/Cu joint has significant value to promote its application in the field of electrical contact. In the study, a novel Sn6Ag7Ni4Co2Ti low-melting high entropy alloy (HEA) was designed and fabricated, and a sound Ti3SiC2/Cu brazed joint was obtained using above filler. The interface of Ti3SiC2/Cu joint brazed with Sn6Ag7Ni4Co2Ti filler is mainly composed of Ag(s,s), Cu(s,s) and a few (Ni, Co)(2)Si. Compared with Ti3SiC2/Cu joint brazed with Ag-26.7Cu-4.5Ti filler, the electrical resistance of the joint brazed with Sn6Ag7Ni4Co2Ti filler is lower at all test temperatures, which is reduced by up to 15.99% when the test temperature is 300 degrees C.