Cost-effective and self-reducible Cu-Ni composite ink for low temperature fabrication of highly conductive and anti-oxidative electrodes

摘要

In this work, an inexpensive and self-reducible Cu-Ni composite ink was designed for low temperature fabrication of the highly conductive and anti-oxidative Cu-Ni electrodes. The Cu-Ni electrode was obtained at a lower sintering temperature originating from the self-catalyzed characteristic of Cu micron particles. Consequently, the Cu-Ni electrode sintered at 180 degrees C exhibits high conductivity with a low electrical resistivity of 7.1 x 10(-5) Omega.cm. and its relative resistance is significantly lower than that of Cu electrode after the high temperature aging test. These results indicate that the self-reducible Cu-Ni composite ink provides a promising prospect for the highly conductive and stable electrode.