机译:Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip
Cent South Univ;
Wuyi Univ;
microelectronics packaging; flip chip reliability; electric-thermal-force multi-field coupling; high current density; thermal interface material; THERMAL-CONDUCTIVITY ENHANCEMENT; PERFORMANCE; PACKAGES; GRAPHENE; SURFACE;