Surface and subsurface formation mechanism of SiCp/Al composites under ultrasonic scratching

摘要

? 2022Rotary ultrasonic machining (RUM) is an effective method of high-quality and high-efficiency machining for advanced composites. However, the machining mechanism and kinematic characteristics of ultrasonic machining of SiC particles-reinforced aluminum matrix (SiCp/Al) composites are yet unclear, limiting the applications of RUM in composites machining. In this study, a rotary ultrasonic vibration-assisted scratch (RUVAS) test was designed for the high-volume fraction of SiCp/Al composites. The kinematic and scratch force model of RUVAS was developed to describe the scratch process of SiCp/Al. Both RUVAS and conventional scratch (CS) tests were performed under various scratch speeds on SiCp/Al. The scratch trajectory was divided into three modes: continuous, semi-continuous, and intermittent. We observed the formation of different surface morphology under different modes. The scratch force difference between RUVAS and CS was insignificant when the scratch speed is high, which indicated that the effect of ultrasonic vibration diminished at a high speed when the ultrasonic frequency was fixed. When assisted by ultrasonic vibration, the scratch morphology of SiCp/Al indicated that the matrix has undergone significant plastic deformation. While the hard SiC particles tended to be ruptured and pressed into the plastic matrix, this mechanism can effectively suppress the initiation and propagation of cracks, which is beneficial to reducing the stress influence zone, healing the surface defects, and improving the surface integrity. The subsurface morphology indicates that the subsurface damage under CS and RUVAS mainly includes particle cracking, matrix tearing, and interface failure. Our experimental result shows that ultrasonic vibration can effectively reduce the subsurface damage of SiCp/Al composites, bringing insight into fundamental mechanisms of ultrasonic machining and providing guidance for the vibration-assisted processing of SiCp/Al composites.