首页> 外文期刊>Panel building and system integration >Heat dissipation in high-power, densely packed enclosures
【24h】

Heat dissipation in high-power, densely packed enclosures

机译:Heat dissipation in high-power, densely packed enclosures

获取原文
获取原文并翻译 | 示例
           

摘要

Over the past few years, components within an electrical control panel have got smaller. This is down to the challenges imposed by clients wanting smaller enclosures to fit within much smaller spaces. With often huge amounts of terminals, wiring, circuit breakers, RCBOs and other general electrical components packed tightly into the panel, trunking up against core high-power components, quarters can be crowded. The result is in an increased ambient heat load surrounding the enclosure, due to restricted airflow and a high density of heat-producing equipment. This makes it even more important to protect these often-expensive electronic components from the excess heat, especially as, for every 10℃ rise in temperature, the reliability of electronic components reduces by 50 percent!

著录项

获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号