AbstractTin‐lead (60Sn‐40Pb) flake poly(ether sulfone) (PES) composites in which the flakes were partially interconnected and of average thickness 2 μm were prepared by hot pressing molten Sn‐Pb particles in a matrix of PES at a temperature above the melting temperature of Sn‐Pb and above the glass transition temperature of PES. Hot pressing at 240°C and 6.51 Mpa resulted in a 15 vol Sn‐Pb composite of lower electrical resistivity and higher electromagnetic interference shielding effectiveness than a PES composite containing 15 vol aluminum flakes that were not formedin‐situ.The electrical properties of thein‐situPES/Sn‐Pb flake composites were much better than those of PES/Sn‐Pb flake composites were fabricated by hot pressing at 310°C (the manufacturer‐suggested fabrication temperature), though the mechanical prope
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