Makers Of Mounters, Solder Materials Leverage Pcb Skills

摘要

In the field of semiconductor manufacturing, new technologies are coming along in rapid succession. Some of the latest include three-dimensional (3D) mounting, which accommodates layering of IC chips, and new device packaging where semiconductor chips are integrated with micro-electromechanical systems (MEMS), optical components or sensors. Manufacturers of mounters and solder materials have begun making forays into semiconductor-manufacturing processes, including processes involving die bonders, wire bonders and micro-ball soldering, by taking advantage of their surface-mount technologies designed for printed circuit boards (PCBs).