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Dependence of intergranular fatigue cracking on the interactions of persistent slip bands with grain boundaries

机译:晶间疲劳开裂对持久滑移带与晶界相互作用的依赖性

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摘要

Intergranular fatigue cracking mechanisms in various copper crystals with different grain boundaries (GBs) were systematically investigated and summarized. In the present investigation, the GBs are classified into three types, i.e. (I) random large-angle GBs parallel, perpendicular or tilting to the stress axis in various copper bicrystals; (II) low-angle GBs parallel or perpendicular to the stress axis in copper columnar crystals; (III) large-angle ∑19b GB in a special (4-bar)1520/18(2-bar)7copper bicrystal. The slip planes of the adjacent crystals are coplanar across the later two types of GBs, but the slip directions of the two component grains are different beside the ∑19b GB. With the help of electron channeling contrast (ECC) technique in scanning electron microscopy (SEM), fatigue cracks and the interactions of dislocations with the GBs in all the fatigued crystals were observed and revealed. The results show that all the largeangle GBs (type I) in copper bicrystals always become the preferential sites to initiate fatigue cracks, independent of the interaction angle between the GB plane and the stress axis. This intergranular fatigue cracking mechanism can be attributed to the piling-up of dislocations at the large-angle GBs. For the columnar crystals containing low-angle GBs (type II), it is observed that persistent slip bands (PSBs), which transfer through low-angle GBs continuously, are the preferential sites for the nucleation of fatigue cracks. However, fatigue cracks were never observed at the low-angle GBs, no matter whether they were perpendicular or parallel to the stress axis. The non-cracking behavior of the low-angle GBs can be explained by the continuity of the dislocations, which led to the disappearance of piling-up of dislocations. For the ∑19b GB (type III), it is found that the favorable fatigue cracking mechanism is still intergranular type in comparison with PSB cracking even though the two component grains have a coplanar slip system. The corresponding GB cracking mechanism should be attributed to the difference in the slip directions between two component grains, which only allows for partial passing through of dislocations across the ∑19b GB. Based on the results above, it is suggested that intergranular fatigue cracking strongly depends on the interactions of PSBs with GBs in fatigued crystals, rather than the GB structure itself. Among all the GBs, only the low-angle GBs are intrinsically strong to resist the nucleation of fatigue cracks under cyclic loading.
机译:系统地研究并总结了不同晶界(GBs)各种铜晶体的晶间疲劳开裂机理。本研究将GB分为3类,即(I)各种铜双晶中平行、垂直或倾斜于应力轴的随机大角度GBs;(II)铜柱状晶体中平行或垂直于应力轴的低角度GBs;(III)大角度∑19b国标专用[(4-bar)1520]/[18(2-bar)7]铜双晶。相邻晶体的滑移面在后两种类型的GB上是共面的,但两种组分晶粒的滑移方向在∑19b GB旁边是不同的。借助扫描电子显微镜(SEM)中的电子通道对比(ECC)技术,观察并揭示了所有疲劳晶体的疲劳裂纹以及位错与GBs的相互作用。结果表明:铜双晶中所有大角GBs(I型)始终成为引发疲劳裂纹的优先位点,与GB平面与应力轴的相互作用角无关。这种晶间疲劳开裂机理可归因于大角度GB处位错的堆积。对于含有低角度GBs(II型)的柱状晶体,观察到连续通过低角度GBs转移的持久滑移带(PSBs)是疲劳裂纹成核的优先位点。然而,在低角度GB处从未观察到疲劳裂纹,无论它们是垂直还是平行于应力轴。低角度GB的不开裂行为可以用位错的连续性来解释,这导致了位错堆积的消失。对于∑19b GB(III型),发现与PSB开裂相比,有利的疲劳开裂机理仍然是晶间型,即使两个组分晶粒具有共面滑移系统。相应的GB开裂机理应归因于两个组分晶粒之间滑移方向的差异,这仅允许位错在∑19b GB上部分通过。基于上述结果,表明晶间疲劳开裂在很大程度上取决于疲劳晶体中PSBs与GBs的相互作用,而不是GB结构本身。在所有GB中,只有低角度GB具有内在的抗疲劳裂纹在循环载荷作用下的成核能力。

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