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Novel Method of Interconnect Worstcase Establishment with Statistically-Based Approaches

机译:基于统计学方法建立互连最坏情况的新方法

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In order for the interconnect effects due to process-induced variations to be applied to the designs in 0.13μm and below, it is necessary to determine and characterize the realistic interconnect worstcase models with high accuracy and speed. This paper proposes new statistically-based approaches to the characterization of realistic interconnect worstcase models which take into account process-induced variations. The Effective Common Geometry (ECG) and Accumulated Maximum Probability (AMP) algorithms have been developed and implemented into the new statistical interconnect worstcase design environment. To verify this statistical interconnect worstcase design environment, the 31-stage ring oscillators are fabricated and measured with UMC 0.13μm Logic process. The 15-stage ring oscillators are fabricated and measured with 0.18μm standard CMOS process for investigating its flexibility in other technologies. The results show that the relative errors of the new method are less than 1.00, which is two times more accurate than the conventional worstcase method. Furthermore, the new interconnect worstcase design environment improves optimization speed by 29.61-32.01 compared to that of the conventional worstcase optimization. The new statistical interconnect worstcase design environment accurately predicts the worstcase and bestcase corners of non-normal distribution where conventional methods cannot do well.
机译:为了将工艺引起的变化引起的互连效应应用于0.13μm及以下的设计,有必要以高精度和高速度确定和表征真实的互连最坏情况模型。本文提出了一种新的基于统计学的方法来表征现实互连最坏情况模型,该模型考虑了过程引起的变化。有效公共几何 (ECG) 和累积最大概率 (AMP) 算法已被开发并实施到新的统计互连最坏情况设计环境中。为了验证这种统计互连最坏情况的设计环境,采用UMC 0.13μm逻辑工艺制造和测量了31级环形振荡器。15级环形振荡器采用0.18μm标准CMOS工艺制造和测量,以研究其在其他技术中的灵活性。结果表明,新方法的相对误差小于1.00%,是传统最坏情况方法的2倍。此外,与传统的最坏情况优化相比,新的互连最坏情况设计环境将优化速度提高了29.61-32.01%。新的统计互连最坏情况设计环境可以准确预测非正态分布的最坏情况和最坏情况拐角点,而传统方法无法很好地做到这一点。

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