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机译:Backward deviation and depth recovery of load-displacement curves of amorphous SiC film under repeating nanoindentation
Department of Mechanical System Engineering, Faculty of Engineering, Hiroshima University, Kagamiyama 1-4-1, Higashi-Hiroshima 739-8527, Japan;
sputtered SiC thin films; repeating nanoindentation; backward deviation; depth recovery; delamination; residual stress;