THIS MONTH'S International Electron Device Meeting (IEDM) in San Francisco (15-17 December) will see Intel, the IBM-led Common Platform Alliance and TSMC face off over 32nm processes, only a year after they did the same with the previous 45nm generation. Intel engineers will describe their aim to implement a 32nm process, which should enable the company to halve the size of its current Penryn-generation processors. It will be Intel's second production process to use a metal gate, which makes it possible to operate circuits at a higher speed than conventional polysilicon gates at such small geometries.
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