Electroless Copper Metallization on Anodized Aluminum Metal Substrates

摘要

It is feasible to complete the metallization of anodized aluminum substrate by electroless copper plating. The copper metallization pattern was obtained on the anodized aluminum sample combining with the photolithography method. The resistivity of anodic film metallized with electroless copper on the sealed aluminum metal substrate was up to the magnitude of 10~(14) #OMEGA# centre dot cm, which satisfied the demands in the electronic packaging.