Comprehensive downsteam effluent management

摘要

Inappropriate handling of downstream effluents in semiconductor manufacturing processes can lead to chip yield loss and excessive equipment downtime. Serious safety issues also result from hazadous effluents trapped as solid depositions in vacuumpipelines. Developed solutions for processes include silicon nitride LPCVD and PECVD, tungsten CVD, aluminum etching, and TEOS/ozone CVD of silicon dioxide.